Fundamentals of Semiconductor Manufacturing Technology
Course Summary
The course covers fundamental manufacturing technologies and processes used in the semiconductor industry for the production of integrated circuits (microchips).
After an introduction to the fundamental properties of semiconductor materials and devices, the processes and methods of microfabrication that underpin the key semiconductor manufacturing technologies will be covered in more detail. This will include photolithography, etching, thermal diffusion and ion implantation doping, oxidation and thin film deposition methods.
The course will also introduce the typical semiconductor characterisation methods and metrology techniques, which are important to the development and fabrication of microchips. Manufacturing issues such as reliability, yield analysis and control, testing and packaging and practical aspects such as cleanroom operation, vacuum technology and gas safety will also be covered.
This course has limited spaces available. Should you be unable to attend, please cancel your booking to allow us to re-allocate your place.
Failure to cancel and or attend may result in you being removed from any future courses.
The following topics will be covered in this course:
- Fundamentals and applications of semiconductors- silicon and III-V, junctions, diodes, MOS, Bipolar and field effect transistors, MOSFETs, Fin-FETS, trench MOSFETs.
- Manufacturing processes- oxidation, diffusion, ion implantation, lithography (UV, EUV, EBL, DLW), wet etching, dry etching (RIE, HDP, RIBE, CAIBE).
- Deposition techniques- thermal, e-beam, sputtering (DC/RF, ICP, magnetron), CVD (LPCVD, PECVD, MOCVD, ALD), copper damascene process (CMP), electromigration.
- Semiconductor fab practicalities- cleanroom operation, vacuum technology, maintenance, safety.
- Metrology- SEM, TEM, EDX, EBSD, FIB, XRD, XPS, SIMS, RBS, Stress, profilometry, AFM, SNOM, interferometry, ellipsometry, 4PP, Hall effect.
- Testing and packaging- test structures, reliability and failure mechanisms, yield, parameter extraction, microelectronic packaging, wire bonding.
The learning outcomes for the course are as follows:
- Gain a broad understanding of semiconductor manufacturing concepts.
- Build in-depth knowledge of semiconductor fabrication methods.
- Become aware of the opportunities, challenges and trends in semiconductor and microelectronics manufacturing.
- Develop foundational knowledge and understanding to support transitioning into the semiconductor manufacturing industry.
This course is suitable for:
- Employees with a relevant undergraduate or postgraduate qualification already working in semiconductor fabs and related.
- Individuals with an undergraduate and/or postgraduate qualification in physics, electrical and/or electronic engineering, mechanical engineering, chemical engineering and chemistry, who are seeking career transition to the semiconductor manufacturing industry.
This course is being delivered by Dr Changhai Wang, Dr. Jose Marques-Hueso, and Professor Marc Desmulliez.
Dr Changhai Wang is an associate professor in microsystems technology and electronics manufacturing. He has over 20 years of research experience in development of microfabrication and micromachining methods principally for manufacturing of polymer and metal-based MEMS devices as well as for advanced microsystem and electronics packaging.
Dr. Jose Marques-Hueso is associate professor at Heriot-Watt University. He is the deputy head of department at electrical, electronics and computer engineering. In 2011, he completed his PhD in the Optoelectronic Materials and Devices Group which was focused on the manufacturing of semiconductor devices (in silicon, InP and GaAs) and on the development of lithographic materials for UV and e-beam lithography. Since February 2017 he has been a lecturer at Heriot-Watt University, where he teaches semiconductor electronics, analogue electronics and electromagnetism.
Professor Marc Desmulliez is deputy director of the Research Institute of Sensors, Signals and Systems of the school of engineering & physical sciences at Heriot-Watt University. Until recently, he was also the director/founder of the MIcrosystems Engineering Centre and created the first UK M.Sc. in microsystems engineering in 2001.
Booking fee: £2200 per delegate
Dates & Venues
| Date | 11, 12, 13, 14, 15 November 2024 |
|---|---|
| Location | NMIS Netherton |
| Duration | 09.00 - 16.30 each day |
| Cost | 2200 |
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